Zhonghang Tiancheng Electronic Technology Co. Ltd. in the Hefei National High-tech Industry Development Zone made the list of the top 10 integrated circuits technologies, making it the only company from Anhui province on the list.

The list was announced at the competition of the 2024 Zhongguancun Forum (ZGC Forum).

The chip module SOP technology, developed by the tech firm, is an innovative packaging technology, which enables different kinds of chips or devices to be integrated into one package, resulting in higher electronic performance and more compact space. 

Featuring miniaturization design, high thermal conductivity, three-dimensional architecture, embedded circuit and high-speed transmission capabilities, the microsystem packaging technology enjoys stronger system functions, better environmental adaptability as well as lower cost, which perfectly meets the needs of product upgrading in aerospace, optoelectronic communication and other fields.

The honor not only shows the Hefei high-tech zone's strength in sci-tech innovation, but also presents its crucial status and great potential in the integrated circuits industry.