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Apple Inc. has started to order components for its new generation of the iPhone, which is expected to hit markets worldwide in the coming third quarter, Sina Tech reported, citing people close to the matter.
According to Apple's suppliers, iPhone 5 will be thinner and lighter, with a more-advanced eight-megapixel camera. The new iPhone will operate on Qualcomm Inc.'s wireless chips, instead of the current chips made by Infineon Technologies AG, they said.
Apple plans to supply 25 million units of the iPhone 5 by the end of the year, while the initial production target was a few millions, said a source with one of Apple's suppliers. "We are told to supply components to Hon Hai Precision Co., which assembles the iPhone for Apple," said the source.
But another source said that the launch of iPhone 5 will be delayed if Hon Hai doesn't raise production. "The iPhone 5 is very complicated and difficult to assemble," the source said.
Hon Hai chairman Terry Guo said last month that his company will raise the production rate and volume in the second half of the year. |
知情人士透露，苹果已经开始为下一代iPhone手机订购零部件，并计划于今年第三季度推出iPhone 5，新浪科技周四引用知情人士消息报道。
来自苹果零部件供应商的消息称，iPhone 5比iPhone 4更薄、更轻，采用800万像素摄像头，无线基带芯片将来自高通，而当前的iPhone 4采用的是英飞凌的基带芯片。
苹果零部件供应商的消息还称：“苹果计划在年底前提供2500万部iPhone 5，最初的产量目标是数百万部，我们被告知在8月份向组装厂商鸿海精密提供零部件。”
但另有消息称，如果鸿海精密不提高产量，很难满足iPhone 5的出货量目标。该消息称：“iPhone 5很复杂，组装起来也困难。”
鸿海精密董事长郭台铭上个月曾表示，计划在今年下半年提升组装能力。 |
