A staff member displays new iPhone 6 smartphones at an Apple premium reseller's shop in Taipei, southeast China's Taiwan, early Sept. 26, 2014.[Xinhua] |
Taiwan-based Digitimes reports that Apple will adopt 0.4t (with a dimension of 3x0.85x0.4mm) LED chips for its backlight units, in order to make its iPhone even thinner than the previous generation.
The report suggests that Apple will use 0.4t LED chips from Japan-based Nichia and Toyoda Gose.
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