The internal parts of a suspected next-generation iPhone. [Photo/9to5mac.com]

New Chip

According to 9to5mac.com, one of the main upgrades to the next iPhone's internal parts will be a redesigned wireless system featuring a new Qualcomm-made LTE chip.

"The new device will include Qualcomm's MDM9635M chip, also known as the '9X35' Gobi modem platform," said the report.

This new chip promises significant performance improvements over the "9X25″ chip found inside the current iPhone 6 and iPhone 6 Plus, capable of delivering up to twice the theoretical LTE download speeds.

Print E-mail

Go to Forum >>0 Comment(s)

Add your comments...

• User Name Required
• Your Comment
• Enter the words you see:   
  Racist, abusive and off-topic comments may be removed by the moderator.